-40%
Kester Solder 24-7150-8866 No-Clean / Sn62Pb36Ag2 / .032 / 2% / Regular
Kester Solder 24-7150-8866 No-Clean / Sn62Pb36Ag2 / .032 / 2% / Regular
Kester Solder 24-7150-8866 No-Clean / Sn62Pb36Ag2 / .032 / 2% / Regular
Kester Solder 24-7150-8866 No-Clean / Sn62Pb36Ag2 / .032 / 2% / Regular
Kester Solder 24-7150-8866 No-Clean / Sn62Pb36Ag2 / .032 / 2% / Regular

Kester Solder 24-7150-8866 No-Clean / Sn62Pb36Ag2 / .032 / 2% / Regular

$ 25.87

Availability: 18 in stock
  • Alloy:: Sn62 Pb36 Ag02 ( 62% tin - 36% lead - 2% silver )
  • Model: SN62/PB36/AG02 NO-CLEAN FLUX CORE
  • Diameter:: .032"
  • Item must be returned within: 30 Days
  • All returns accepted: Returns Accepted
  • MPN: 24-7150-8866
  • Condition: New
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money Back
  • Country/Region of Manufacture: United States
  • UPC: Does not apply
  • Solder Form: wire
  • Core Size:: 2.2% per volume ( 50 )
  • Brand: KESTER SOLDER

    Description

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    Regular Price $ 72.70
    "245" No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.
    • Compatible metals: Platinum, gold, copper, tin, solder and silver.
    • New Old Stock
    • Kester P/N: 24-7150-8866
    • Alloy: Sn62 Pb36 Ag02 ( 62% tin - 36% lead - 2% silver )
    • Diameter: .032"
    • Flux: #245 No-Clean Rosin
    • Core: 2.2% by volume (58)
    •
    DOM: 1999
    • Qty: 1 Lb. spool
    • Flux residues are non-corrosive and non-hydroscopic
    • Specifications: ANSI-J-STD-006, Federal Spec: QQ-S-571e.
    •
    Concorde is an Authorized Kester Solder distributor
    •
    Bulk quantity offers accepted. Serious offers only. Send email via eBay ( Attn: Dana )
    Sn62 Pb36 Ag02 Product Performance
    • Most common tin-lead eutectic used in pcb assembly applications
    • Non-corrosive, non-conductive post-soldering residue
    • Residues are kept to a minimum
    • Most applications do not require residue removal